JPH0510358Y2 - - Google Patents
Info
- Publication number
- JPH0510358Y2 JPH0510358Y2 JP1988018771U JP1877188U JPH0510358Y2 JP H0510358 Y2 JPH0510358 Y2 JP H0510358Y2 JP 1988018771 U JP1988018771 U JP 1988018771U JP 1877188 U JP1877188 U JP 1877188U JP H0510358 Y2 JPH0510358 Y2 JP H0510358Y2
- Authority
- JP
- Japan
- Prior art keywords
- punch
- resin
- burr
- lead frame
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988018771U JPH0510358Y2 (en]) | 1988-02-16 | 1988-02-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988018771U JPH0510358Y2 (en]) | 1988-02-16 | 1988-02-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01123339U JPH01123339U (en]) | 1989-08-22 |
JPH0510358Y2 true JPH0510358Y2 (en]) | 1993-03-15 |
Family
ID=31233706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988018771U Expired - Lifetime JPH0510358Y2 (en]) | 1988-02-16 | 1988-02-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0510358Y2 (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS619299U (ja) * | 1984-06-19 | 1986-01-20 | 日本電気株式会社 | ダイバ切断型用ポンチ |
-
1988
- 1988-02-16 JP JP1988018771U patent/JPH0510358Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH01123339U (en]) | 1989-08-22 |
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